PCB Designing Course

Join our workshop to explore the world of PCB Designing

PCB Designing Training

Getting started with Tools

The Capture work environment

Starting a project

Setting up your project

Design structure

Placing, editing, and connecting parts and electrical symbols

Adding and editing graphics and text

Changing your view of a schematic page

About libraries and parts

Creating and editing parts

About the processing tools

Preparing to create a net list

Creating a net list

Creating reports

Exporting and importing schematic data

What is a PCB and why do we use them

Physical PCB construction

PCB Workflow

Footprint generation


Parts placement

Mechanically defined components

Routing guidelines setting

PCB Construction (Power and Ground Plane)

Routing guidelines


Copper Pour

DRC Checking

From Layout to production

Schematic capture

From schematic to PCB

Parts placement and routing

Making footprints

Post Process


  • Telecom
  • Avionics and Aerospace
  • Automotive
  • Network and Infrastructure
  • Robotics
  • Medical Electronics
  • Industrial Automation
  • DSP
  • Wireless


For those of working professionals Keeping your design skills up to date requires continually learning and exploring the latest tools, techniques, and methodologies. Our training course program keep you learning & updated.

Schematic capture or schematic entry is done through an EDA tool

Card dimensions and template are decided based on required circuitry and case of the PCB. Determine the fixed components and heat sinks if required.

Deciding stack layers of the PCB. Multi layers depending on design complexity. Ground plane and Power plane are decided. Signal planes where signals are routed are in top layer as well as internal layers.

Line impedance determination using dielectric layer thickness, routing copper thickness and trace-width. Trace separation also taken into account in case of differential signals. Microstrip, stripline or dual stripline can be used to route signals.

Placement of the components. Thermal considerations and geometry are taken into account. Vias and lands are marked.

Routing the signal trace. For optimal EMI performance high frequency signals are routed in internal layers between power or ground planes as power plane behaves as ground for AC.

Gerber File generation for manufacturing.